Telepath Technologies Co., Ltd. is a newly founded fabless company which mainly offers the CMMB compliant mobile TV chip solutions. Telepath is committed to be the world leading provider for total digital TV chip solutions.

        Telepath’s core team consists of Dr. Liu Hui, co-founder of CMMB channel technology and a whole team with rich experience in CMMB mobile TV system application and chip development. Telepath, in cooperation with the strategic partners, Infineon, the world leading semiconductor manufacturer, and SMIC, the leading domestic foundry, has completed the pipeline from concept design to qualification and fully prepared for mass production. This enables Telepath to provide volume commercial demodulator chip and lays the foundations to offer CMMB SoC chips with high performance in the future.

        Telepath Technologies Co., Ltd., a mobile multimedia broadcasting chip solution provider, unveils S301AB, a demodulator chip. S301AB enables access to mobile multimedia broadcasting via mobile handhelds, personal media players as well as other portable electronic devices.
        S301AB is fully compatible with CMMB channel transmission and multiplexing standards. It is the first solution that exactly meets the requirement of multi bit rates in channel transmission standards and demodulation and de-multiplexing in different modes. It can meet or exceed all expectations of manufacturers seeking mass production based on the CMMB platform, in terms of power consumption, size factor and receiving sensitivity, and supports a number of general interfaces, such as SDIO, SPI and I2, that enables the mobile phone and portable device manufactures to achieve flexible implementation with multi front-end RF solutions and back-end application solutions. S301AB is manufactured with 0.13um CMOS process.
        S301AB was developed by Telepath, in cooperation with Infineon Technologies, the world leading semiconductor products and solutions provider. And it’s being fabricated by the leading domestic foundry company, SMIC.
        “The success of tape out the S301AB at one stroke, should be contributed to the great support from TiMiTech, exceptional efforts from our tech team and sufficient cooperation from Infineon Xi’an design center. We are very glad to establish the long term strategic partnership with Infineon, and believe Infineon will be capable to deliver the system level chip platform solutions in terms of its wide product series and the leading position in the world semiconductor industry. I am also grateful to SMIC for their help on offering us a native supply chain with high quality and capacity. This success enables us to be well prepared to realize the CMMB application and catch the business opportunity before the 2008 Olympic games. Also the favorable cooperation relationship with the above said partners proves to be a stable base for our further product development to accommodate the future marketing.” Said Li Qun, CEO of Telepath Technologies.

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